Crystal bases substrate materials tend to be brittle and can fracture easily if handled improperly. Chips or cracks appearing on the edge of the substrate after polishing create a stress point that can propagate across the entire surface of the part, resulting in a fractured product. Reynard has developed an edge polishing process that resolves these edge fractures to create a more robust substrate. Since the hardness of crystalline materials varies greatly, the polishing process is tuned to a specific material type and, typically, involves a multi-stage polish. This process has been shown to resolve fracture points that exist on the surface of the substrate, as well as resolving potential defects inside of large area edge chips.